RF System-in-Package
The RF System-in-Package (RFSiP) combines powerful, multi function processing with industry leading analog to digital and digital to analog (ADC/DAC) capability. This advanced RF processor is delivered in a SWaP-C optimised Ball Grid Array (BGA) package.
• Advanced commercial semiconductor technology
• AMD Versal® Adaptive Compute Acceleration Platform (ACAP) FPGA VC1902
• Jariet high-speed data converters and integrated power and memory
• Compact size measuring 50 mm by 50 mm
• Defence-grade package and chip-level security integration
Product Name:
Description:
Description
The RFS1140 device offers the most advanced processing capability for applications where ultra-low data latency is critical for success. It provides direct digitization of RF signals up to 32 GHz, with 4 channels each of ADC and DAC data conversion operating at 64 GSPS per channel.
- Direct digitization of RF signals up to 32 GHz
- 4 channels each of ADC & DAC with conversion rates from 40 to 64 GSPS
- Broad instantaneous bandwidth > 4 GHz
- Operating temperature range -40 C to +85 C
- Max power 145 W, Typical 125 W
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